Ted J. Hubbard and Erik K. Antonsson
Engineering Design Research Laboratory
Division of Engineering and Applied Science
California Institute of Technology
This paper presents a model for determining the full three dimensional etch rate behavior from experimentally determined rates of four principal planes: (100), (110), (111), and (311). The model shows excellent agreement with both experimental measurements and values reported in the literature. A high quality 3D model of etch rates, such as this one, is a critical element of any structured MEMS design approach.