Caltech SEGS Etch Simulator, Example Results Gallery
Example SEGS 3-D anisotropic etch simulation time-evolution results:
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A Dynamic Simulation of two square holes merging. (July, 1998)
in GIF format. (268k)
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A Dynamic Simulation of two square holes merging. (November, 1998)
in QuickTime movie format.
(536k)
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An EDP etched insulating well in <100> silicon underneath a suspended
NIST heater
(pixel-160x160.cif)
presented in:
"Realizing Suspended Structures on Chips Fabricated by CMOS Foundry
Processes Through the MOSIS Service,"
by J. Marshall et al.,
NIST publication NISTIR 5402.
Isometric views (9/page)
in PostScript format
(117k),
or
in PDF format (29k).
Top views (9/page)
in PostScript format
(118k),
or in PDF format (28k).
Isometric views (1/page)
in PostScript format
(120k),
or
in PDF format (47k).
Top views (1/page)
in PostScript format
(121k),
or in PDF format (45k).
Detailed information on the etch simulation is available
here.
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Four trapezoidal holes merging into a rectangular hole
in PostScript format
(450k),
or in PDF format (97k).
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Rectangular hole with central protrusion
in PostScript format
(13k),
or in PDF format (4k).
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Two square holes merging, every third timestep shown, eight on one page
in PostScript format (41k),
or in PDF format (12k).
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Two square holes merging, every third timestep shown, nine per page
in PostScript format (96k),
or in PDF format (24k).
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Two square holes merging, every timestep shown, nine per page
in PostScript format (432k),
or in PDF format (98k).
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Two square holes merging, every timestep shown, one per page
in PostScript format (438k),
or in PDF format (142k).
-
A curved micro-flow channel, every timestep shown, one per page
in PostScript format (36k),
or in PDF format (16k).
-
A curved micro-flow channel in a 110 wafer,
every timestep shown, one per page
in PostScript format
(33k),
or in PDF format (15k).
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An angled micro-flow channel, every timestep shown, one per page
in PostScript format (24k),
or in PDF format (21k).
- Crystal planes (59k)
- Donut shaped hole (38k)
- Compensated square peg (20k)
- Collection of etched shapes
(64k)
- Close-up view of cross and diamond
(19k)
- Some etchant guidelines
(12k)
The following figures were generated with simulators developed at Caltech.
The conditions approximate a EDP/KOH etchant on a 100 wafer.
Along with each Postscript file is a brief text description file.
2D figures and simulations
Last updated August 25, 1997.
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