Material Properties

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Silicon  Young's Modulus    Failure Stress    Poisson's Ratio
               E              sigma_f             mu
Ref          [GPa]              [MPa]
-------------------------------------------------------------
 1)           190               7,000
 2)                             6,894
 3)           150               7,000-300         0.17
 4)           150
 5)                               700
 6)           132
 7)           190                                 0.09
 8)           168                                 0.066
 9)           162                                 0.228
10)           170
11)           169.8                               0.062
12)           178.6                               0.234
13) <100>     130             3,400-1,100         0.064
13) <110>     161               2,300             0.279
13) <111>                       1,300
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PV)           170               7,000             0.20
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 1) K.Petersen, "Silicon as a Mechanical Material",
    Proceedings of the IEEE, Vol 70, No. 5, May, 1982, pages 420-457
 2) F.Pourahmadi, D.Gee and K.Petersen,
   "The Effect of Corner Radius of Curvature on the Mechanical Strength
     of Micromachined Single-Crystal Silicon Structures,
    IEEE Transducers'91, 197-200.
 3) J.McEntee http://bell.mma.edu/~jmcent/siliconprop.htm
 4) K.Sato, M.Shikida, T.Yoshioka, T.Ando and T.Kawabata,
    "Micro Tensile-Test of Silicon Film Having Different Crystallographic
     Orientations",
    IEEE Transducers'97, Paper 2D1.02, Chicago, Ill, June, 1997
 5) W.Suwito, M.L.Dunn and S.J.Cunningham (U.Colorado),
    "Mechanical Behavior of Structures for Microelectromechanical Systems",
    IEEE Transducers'97, Paper 2D1.06P, Chicago, Ill, June, 1997
 6) L.M.Zhang, D.Uttamchandi and B.Culshaw,
    "Measurement of the Mechanical Properties of Silicon Microresonators",
    Sensors and Actuators A, 29 (1991) 79-84.
 7) 
 8) H.Elgamel,
    "Closed-Form Expression for the Relationships between Stress, Diaphragm
     Deflection, and Resistance Change with Pressure in Silicon Piezoresistive
     Pressure Sensors",
    Sensors and Actuators A, 50 (1995) 17-22.
 9) H.Guckel,
    "Silicon Microsensors: Construction, Design and Performance",
    Microelectronic Engineering 15 (1991) 387-398.
10) Y.Zhang and K.Wise,
    "Performance of Non-Planar Silicon Diaphragms under large Deflection",
    Journal of Microelectromechaical Systems, Vol.3., No.2, June, 1994, 59-68.
11) Z.Djuric, M.Matic, J.Matovic, R.Petrovic and N.Simicic,
    "Experimental Determination of Silicon Pressure Sensor Diaphragm
     Deflection",
    Sensors and Actuators A, 24 (1990) 175-179.
12) Y.Matsuoka, Y.Yamamoto, K.Yamada, S.Shimada, M.Tanabe, A.Yasukawa
    and H.Matsuzaka,
    "Characteristic Analysis of a Presssure Sensor Using the Silicon  
     Piezoresistance Effect for High-pressure Measurements",
    Journal of Micromechanics and  Microengengineering, 5 (1995) 25-31.
13) C.Wilson and P.Beck,
    "Fracture Testing of Bulk Silicon Microcantilever Beams Subjected
     to a Side Load",
    Journal of Microelectromechaical Systems, Vol.5., No.3, June, 1996,
    142-150.
    

PV) Preferred values


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Poly-Si  Young's Modulus    Failure Stress    Poisson's Ratio
               E              sigma_f             mu
Ref          [GPa]              [MPa]
-------------------------------------------------------------
 1)           169               1,200             0.22
-------------------------------------------------------------
 1) W.N.Sharpe, Jr., Bin Yuan, R.L.Edwards, and R. Vaidyanathan,
    (Johns Hopkins U.)
    10th IEEE International Workshop on Microelectromechanical Systems,
    Nagoya, Japan, January 26-30, 1997.

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Si3N4    Young's Modulus    Failure Stress    Poisson's Ratio
               E              sigma_f             mu
Ref          [GPa]              [MPa]
-------------------------------------------------------------
 1)           270               2,000             0.27
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 1) S.Jansson, Aerospace Corporation